ZEON Corporation, a leading provider of adhesive solutions, showcased their innovative easy-disassembly multi-material adhesives at IPF JAPAN 2023. The adhesives, which adhere in just one minute and dissolve in 10 seconds, offer a solution to the challenge of recycling and disassembly in the mobility field. With features such as multi-material adhesion, low water absorbency without hydrolysis, electric corrosion resistance, impact resistance, low dielectric properties, and easy dismantling, these adhesives can securely bond both organic and inorganic materials without the need for pre-treatment. The dissolution demonstration impressed attendees, as the adhesive was dissolved within just five seconds. Overall, the multi-material adhesives presented by ZEON have the potential to revolutionize the industry and contribute to more sustainable practices.Generated by OpenAI
website:https://www.zeon.co.jp/
